Zhejiang Arbueo Intelligent Equipment Manufacturing Co., Ltd.

Common Issues, Causes, and Solutions in PC Injection Molding

Apr 08, 2026 Leave a message

PC material has high viscosity, poor flowability, is extremely sensitive to moisture, is prone to stress cracking, requires high mold temperature, and is easily scorched.

 

I. Silver Streaks / Water Marks / Gas Marks (Most Common)
Phenomenon: Silver-white thread-like streaks, a misty appearance, or water-mark patterns on the surface.
Causes:

  • PC material has absorbed excessive moisture and was either not dried or insufficiently dried.
  • Material temperature is too high, causing material decomposition and the generation of gas.
  • Injection speed is too fast, resulting in air entrapment.
  • Screw back pressure is insufficient, preventing complete air expulsion.
  • Poor mold venting.

Solutions:

  • Ensure thorough drying: Dry at 110–120°C for 3–4 hours; for recycled material, extend drying time to 4–6 hours.
  • Lower the barrel temperature to prevent thermal decomposition.
  • Reduce the injection speed, particularly during the initial phase.
  • Increase back pressure to ensure complete air expulsion.
  • Improve mold venting by adding vent channels.

 

II. Cracking / Brittle Fracture / Stress Cracking
Phenomena:Cracking during demolding, cracking during assembly, cracking after storage, screw boss bursting.
Causes:

  • Excessive internal stress (due to high injection speed, high shear stress, or large temperature differentials).
  • Mold temperature is too low, or cooling is too rapid.
  • Uneven ejection or "ejector whitening" leading to stress concentration.
  • Material temperature is too low, resulting in poor plasticization.
  • Insufficient draft angle, causing tearing or cracking during demolding.
  • Contact with chemicals or greases inducing cracking.

Solutions:

  • Increase mold temperature to 70–100°C to reduce internal stress.
  • Reduce injection speed and minimize shear stress.
  • Adjust ejector pins and increase the ejection area to prevent ejector whitening.
  • Appropriately increase material temperature to improve flowability.
  • Increase the draft angle.
  • Avoid contact with organic solvents; perform an annealing treatment if necessary.

 

III. Short Shots / Uneven Flow / Insufficient Filling
Phenomenon: Corners, thin-walled sections, and deep ribs fail to fill completely.
Causes:

  • PC material exhibits high viscosity and poor flowability.
  • Melt temperature and/or mold temperature are too low.
  • Injection pressure and injection speed are insufficient.
  • Runners and/or gates are too small.
  • Poor venting leads to trapped air and flow blockage.
  • Insufficient back pressure results in uneven plasticization.

Solutions:

  • Increase melt temperature to 280–310°C.
  • Increase mold temperature to 80–100°C.
  • Increase injection pressure and injection speed.
  • Appropriately enlarge the gates and runners.
  • Improve venting to eliminate trapped air.
  • Increase back pressure to ensure proper plasticization.

 

IV. Prominent Weld Lines and Poor Strength
Phenomenon: Weld lines are deep, discolored (whitish), and prone to breakage.
Causes:

  • Material temperature and/or mold temperature are too low, resulting in poor weld strength.
  • Injection speed is too slow, causing the flow front of the molten material to cool prematurely.
  • Poor venting leads to air entrapment at the weld line junction.
  • Improper gate placement results in an excessively long flow path.

Solutions:

  • Increase the material temperature and mold temperature.
  • Appropriately increase the injection speed.
  • Add vents at the location of the weld lines.
  • Optimize gate placement to shorten the flow path.
  • Install a cold slug well if necessary.

 

V. Bubbles / Internal Voids
Phenomenon: Bubbles or voids present on the surface or within the part.
Causes:

  • Raw material contains moisture, which vaporizes at high temperatures.
  • Material temperature is excessively high, leading to thermal decomposition and gas generation.
  • Injection speed is too fast, resulting in air entrapment.
  • Insufficient holding pressure prevents proper compaction.
  • Cooling shrinkage in thick-walled sections creates internal vacuum voids.

Solutions:

  • Thoroughly dry the raw material.
  • Reduce the barrel temperature.
  • Reduce the injection speed during the initial phase.
  • Increase the holding pressure and extend the holding time.
  • For thick-walled parts, employ a slow injection speed combined with high holding pressure. 

 

VI. Flash / Burrs
Phenomenon: Material overflow at the parting line or inserts.
Causes:

  • Material temperature is too high, resulting in excessive fluidity.
  • Injection pressure/speed is too high, leading to overfilling.
  • Clamping force is insufficient.
  • Excessive clearance in the mold mating surfaces.
  • Holding pressure is too high; cooling is delayed.

Solutions:

  • Appropriately lower the material temperature.
  • Reduce the injection pressure and speed.
  • Increase the clamping force.
  • Modify the mold to reduce mating clearance.
  • Lower the holding pressure to avoid overfilling. 

 

VII. Black Spots, Black Streaks, and Scorching
Phenomena: Black spots, yellowing, scorching, burn marks
Causes:

  • Excessive material temperature; thermal decomposition of PC material.
  • Material residence time in the screw is too long.
  • Poor venting; localized high-temperature compression leading to scorching.
  • Carbon buildup in the barrel or nozzle.
  • Excessive injection speed; shear overheating.

Solutions:

  • Lower the material temperature; shorten the cooling cycle.
  • Minimize downtime; purge the barrel before shutting down.
  • Improve venting to prevent trapped air and compression burning.
  • Clean the barrel, screw, and nozzle.
  • Reduce injection speed to minimize shear heat .

 

VIII. Warpage and Deformation
Phenomenon: Bending, twisting, dimensional instability
Causes:

  • Uneven cooling, high internal stress.
  • Mold temperature too low or uneven.
  • Unbalanced ejection.
  • Excessively fast injection speed, severe molecular orientation.
  • Uneven product wall thickness.

Solutions:

  • Increase and equalize mold temperature; extend cooling time.
  • Reduce injection speed to minimize molecular orientation.
  • Adjust ejection balance.
  • Optimize product wall thickness design.
  • Perform annealing treatment if necessary.

 

IX. Poor Gloss, Matte Finish, Dull Surface
Phenomenon: Lack of luster, hazy appearance, absence of a mirror-like finish.
Causes:

  • Mold temperature is too low.
  • Material temperature is insufficient.
  • Mold surface roughness is excessive.
  • Poor venting.
  • Raw material contains moisture.

Solutions:

  • Increase mold temperature to 90–100°C.
  • Appropriately increase material temperature.
  • Polish the mold and optimize surface texturing.
  • Improve venting.
  • Ensure the raw material is dry. 

 

Ⅹ. Ejector Whitening, Protrusion, and Bulging
Phenomenon: Whitening or raised bumps appear at the ejector pin locations.
Causes:

  • Low mold temperature; the molded part is overly brittle.
  • Uneven ejection; the ejector pins are too small.
  • Ejection occurs before sufficient cooling is complete.
  • Insufficient draft angle; high "clamping force" (part adhesion to the mold).
  • Excessive internal stress within the part.

Solutions:

  • Increase the mold temperature.
  • Increase the diameter of the ejector pins and/or increase the number of pins.
  • Extend the cooling time.
  • Increase the draft angle.
  • Optimize processing parameters to reduce internal stress.